Multilayer PCB for High-Current Converter

I need a power-electronics specialist to take my high-frequency resonant converter from concept to production-ready multilayer PCB. The heart of the job is the board layout in Altium Designer, but success hinges on excellent EMI/EMC behaviour, solid thermal management and reliable high-current paths. Here’s what I have so far: complete schematics, key component selections and preliminary LTspice simulations. What I’m missing—and what I’m hiring you for—is a clean, fabrication-ready Altium project that respects controlled-impedance routes, minimizes switching noise and keeps temperature rise well within spec. If you have past wins in wireless power transfer or EV chargers, that insight will fit perfectly with the power levels and frequencies we’re targeting. Deliverables • Altium Designer project files (schematic + PCB) with stack-up defined and all design rules documented • Gerbers, drill files and ODB++ package ready for a 4-6 layer build • Updated BOM with manufacturer part numbers and alternates • LTspice model refined to match the final layout’s parasitics • Brief design report summarising EMI/EMC strategy, thermal simulations and current-density checks Acceptance criteria: board passes your own ERC/DRC without waivers, meets IPC-6012 class 2 at minimum, and demonstrates—through simulation or prior lab data—compliance with CISPR-25 conducted emissions targets. If this sounds like your territory, let’s talk timeline and milestones right away.

Project ID: 40523344