PDMS is currently being heavily studied for impact and vibration resistance packaging of harsh environment electronics. Continuous assessment of stress and strain within these packages during operation is necessary, in most cases wirelessly for monitoring actual state of the component. If the flexible material in this case PDMS can be used as a sensing platform as well it will offer multi functionality by providing both necessary mechanical robustness and necessary strain sensing capability.
Main objective of the work are as follows
1. Design and develop PDMS substrate with embedded Meta material features
2. Fabricate substrates
3. Test it under low velocity impact load.