ESC Design and Development Specialist

Required Experience: Electrostatic Chuck (ESC) Design & Development Ceramic ESC design and material selection (Al₂O₃, AlN, TiO₂-doped, etc.) Electrostatic clamping mechanism design: Johnsen-Rahbek type, Coulomb type, hybrid type, etc. Electrode pattern design and multilayer ceramic lamination technology High-purity, high-density ceramic sintering and machining technology Optimization of plasma resistance, thermal conductivity, and insulation properties Semiconductor Equipment Related Technology Process equipment design and development for CVD, PVD, etching, ion implantation, annealing, etc. Hands-on experience in vacuum technology, plasma control, temperature control, gas flow control, etc. Wafer transfer system design (load lock, robot hand, vacuum chuck, etc.) Equipment maintenance, failure analysis, and yield improvement Materials & Manufacturing Process Forming, sintering, and machining of high-purity ceramic powders (AlN, Al₂O₃, SiC, etc.) Thin film formation processes (CVD, PVD, sputtering) Surface treatment and planarization (CMP, polishing, etching) technology Manufacturing management in cleanroom environments Application & Market Insight Advanced logic, memory (DRAM, NAND), power semiconductor manufacturing process experience Development or manufacturing experience at major manufacturers (Applied Materials, LAM Research, TEL, Hitachi High-Tech, SEMES, Kyocera, NTC, etc.) Technical strategy for localization, cost reduction, and performance enhancement Quality & Reliability Evaluation Evaluation of wafer clamping flatness, leakage current, dielectric strength, thermal cycle lifetime, etc. Reliability testing for particle generation, metal contamination, plasma erosion, etc. Work Arrangement: Flexible engagement model (primarily part-time/consulting basis) Both remote (online) and on-site collaboration available Project-based technical consulting Long-term technical advisory arrangements are also open for discussion

Project ID: 40392361