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4-Layer ESP32 Hardware Optimization & Thermal Simulation (Current: 85% Schematic) ===================================================================== PROJECT BUDGET & BIDDING TERMS: • Budget: Strict Fixed Price between $40.00 USD and $70.00 USD. • Selection Criteria: The best, most technically sound proposal strictly within this budget range ($40 - $70) will be awarded immediately. • NDA Required: A signed NDA is mandatory prior to releasing existing KiCad schematic source files. • Notice: Bids exceeding $70 or generic placeholder bids will be ignored automatically. • Anti-Spam Check: Start your proposal with the exact passphrase: "TITAN-VALIDATED". ===================================================================== ### Project Overview: We ...

Project objective: We are developing a food dehydrator. Our first priority is achieving uniform airflow across all 21 trays and across the usable area of each tray. This assignment focuses on designing an airflow prototype that can be tested at room temperature before integrating heating or a heat-pump system. Scope of work - Agree on chamber dimensions, tray spacing, airflow direction, and target velocity. - Develop and compare practical supply-plenum, return-plenum, and tray-channel arrangements. - Assess features such as tapered plenums, guide vanes, perforated plates, baffles, and adjustable balancing openings. - Account for airflow resistance from both empty trays and food-loaded trays. - Estimate total airflow, pressure losses, and the required blower operating point. - Evaluate ...

***PM me examples of this work if bidding*** We are looking for a qualified building physics/thermal consultant to carry out a project-specific U-value calculation and interstitial condensation risk assessment for a timber-frame wall system in Ireland. Wall system includes: 600 mm stud centres 140 mm λ0.032 wool insulation OSB sheathing Kingspan ThermaBoard TF70/TP10 PIR – 50, 70, 80 & 100 mm options 35 mm external battens Breather membrane Ventilated external cavity Internal airtightness/vapour-control membrane Plasterboard We require: Accurate U-value for each wall option Interstitial condensation/moisture risk assessment Thermal bridging/timber fraction taken into account Assessment to relevant Irish/European standards Professional calculation report suitable for inc...

I’m developing a power bank whose two non-negotiable strengths are high capacity and true fast-charging performance. The unit will mainly top-up smartphones, so efficiency at the 5 V–20 V range matters more . I need a complete design package, looking on using Texas Instruments chips. The bank should expose 1 USB-A and 2 USB-C output ports (bidirectional)( 100W power output); USB-C Power Delivery and Qualcomm QC compatibility are welcome provided they don’t compromise overall capacity or ramp up BOM costs unreasonably. The board needs to have headers connectors as well. It will be connected to an Lilygo ESP32-S3 dev board for monitoring. Please base the electronics around readily available components, specify all ICs, and include thermal considerations, safety certifi...

Project Title: Thermal Simulation and Heatsink Design for a 72 V EV Powertrain Controller – 15 kW Rated, 25 kW Peak We are developing an electric-vehicle powertrain controller and are looking for an experienced freelancer to undertake semiconductor loss estimation, thermal simulation, cooling-system selection and manufacture-ready heatsink design. The assignment must include complete editable calculation files, simulation models, mechanical CAD files and manufacturing drawings so that our team can manufacture the cooling system and modify the design independently. PROJECT SPECIFICATIONS * Nominal DC input voltage: 72 V/108V * Continuous rated power: 15 kW * Peak power: 25 kW * Application: EV traction motor controller * Power semiconductor: To be selected through analysis, with l...