Our Capabilities
High Speed digital, Analog, Mixed and RF designs
Expertise in designing PCI, CPCI, Mother Boards, FPGAs, BGAs, Bluetooth Devices, Backplane Boards and PDAs
High Layer count boards : upto 62 layers
High Speed Boards : 15 GHz
Impedance controlled Designs with delay matching, Stack-up and material selection.
Designs with Micro Vias, Blind Vias, Buried Vias and backdrill.
FP creation as per IPC7351 (A,B and C) including if any customer specifications standards.
Fine Pitch BGA (0.5mm), High Pin count BGA (1900+ pins)
We have taken up designs with 3 mil/ 3 mil track width/spacings. Design technologies with micro via HDI technology with 4 mils drill micro via
We are experienced in handling highly complex PCB designs for cutting-edge technologies for various applications like Defence, Aerospace, Telecom, Medical,Industrial and consumer electronics.
Service Highlights
Exclusive engineering team for analysis and verification
Exclusive in-house tool development team for process integration
Complete documentation packages
Interaction with in-house Signal Integrity experts
Interaction with the industry proven fabricators
IPC certified designers
Latest EDA tool platforms for designing and Analysis
In-house developed tools for QC and routing
Design reviews using web-conferencing
Work round the clock towards meeting design delivery schedules
Schedules based on targets
Team work for designing
Disciplined workforce for long-term relationship